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mps2r10 - 606 datasheet 50 mhz to 1 ghz rohs compliant spdt monolithic pin switch downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 2 microsemi corporate headquarters one enterprise, aliso viejo, ca 92656 usa within the usa: +1 (800) 713 - 4113 outside the usa: +1 (949) 380 - 6100 sales: +1 (949) 380 - 6136 fax: +1 (949) 215 - 4996 e - mail: sales.support@microsemi.com ? 2015 C 2016 microsemi corporation. all rights reserved. microsemi and the microsemi logo are trademarks of microsemi corporation. all other trademarks and service marks are the prop erty of their respective owners. microsemi corporation (nasdaq: mscc) offers a com prehensive portfolio of semiconductor and system solutions for communications, defense & se curity, aerospace and industrial markets. products include high - performance and radiation- hardened analog mixed - signal integrated circuits, fpgas, socs and asics; po wer management products; timing and synchronization devices and precise ti me solutions, setting the world's standard for time; voice processing devices; rf solutions; discrete components; enterprise storage and communications solutions, security technologi es and scalable anti - tamper products; ethernet solutions; power - over - ethernet ics and midspans; as well as custom design capabilities and services. microsemi is head quartered in aliso viejo, california and has approximately 4,800 employees globally. learn more at www.microsemi.com microsemi makes no warranty, representation, or guarantee reg arding the information contained herein or the suitability of its products and services for any particular purpose, nor do es microsemi assume any liability whatsoever arising out of the application or u se of any product or circuit. the products sold hereunder and any other products sold by microsemi h ave been subject to limited testing and should not be used in conjunction with mission - critical equipment or applications. any performance specifications are believed to be reliable but are not verified, a nd buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end - products. buyer shall not rely on any data and performance specifications o r parameters provided by microsemi. it is the buyers responsibility to independentl y determine suitability of any products and to test and verify the same. the information provided by microsemi he reunder is provided as is, where is and with all faults, and the entire risk associated with such informatio n is entirely with the buyer. microsemi does not grant, explicitly or implicitly, to any party any patent ri ghts, licenses, or any other ip rights, whether with regard to such information itself or anything desc ribed by such information. information provided in this document is proprietary to microse mi, and microsemi reserves the right to make any changes to the information in this document or to any prod ucts and services at any time without notice. downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 3 revision history 1.1 revision 1.0 revision 1.0 was the first publication of this document. 1.2 revision 1.1 in revision 1.1, this document was rebranded to the microsemi format. there were no changes to the technical content. downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 4 contents revision history .............................................................................................................................. 3 1.1 revision 1.0 ................................................................................................................................................ 3 1.2 revision 1.1 ................................................................................................................................................ 3 2 product overview .................................................................................................................... 6 2.1 applications ............................................................................................................................................... 6 2.1.1 key features ................................................................................................................................ 6 3 electrical specifications ............................................................................................................ 7 3. 1 absolute maximum ratings ....................................................................................................................... 7 3.2 typical electrical performance ................................................................................................................... 7 3.3 typical electrical performance ................................................................................................................... 7 3.4 small signal swept measurements ............................................................................................................ 8 4 schematic ............................................................................................................................... 10 4.1 dc bias conditions and logic ................................................................................................................... 10 5 package outline ...................................................................................................................... 11 5.1 backside solder pad dimensions ............................................................................................................. 12 5.2 installation and handling ......................................................................................................................... 12 5.2.1 manual handling and installation .............................................................................................. 12 6 evaluation board assembly .................................................................................................... 14 7 tape and reel format ............................................................................................................ 15 downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 5 list of tables table 1 absolute maximum ratings ................................................................................................ . 7 table 2 typical electrical performance ( 100 v control) ................................................................... 7 table 3 typical electrical performance (5 v control) ....................................................................... 7 table 4 switching control signals ................................................................................................... 10 table 5 dc bias condit ions and logic ............................................................................................. 10 downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 6 2 product overview the mps2r10 - 60 6 is a rohs compliant h igh power monolithic microwave surface mount (mmsm) series - shunt pin diode sp2t reflective switch. the technology is a packaged/device integration accomplished at the wafer level. thermal transfer is optimized by elimination of the traditional package interface. the mps2r10 - 606 is completely compatible with pick and place and solder reflow manufacturing techniques. this series of diodes meets rohs requirements per eu directive 2002/95 /ec. the standard terminal finish is gold unless otherwise specified. consult the factory if you have special requirements. ? esd hbm class 1b ? m oisture sensitivity msl 2 2.1 applications the mps2r10 - 606 device is optimized for uhf high power and t/r switching applications. up to 1 watt cw po wer handling with as little as 5 v control. 2.1.1 key features the following are the key features of the mps2r10 - 606 . ? series - shunt pin diode sp2t ? 100 w cw power handling ? low insertion loss ? high isolation ? surface mount ? 0805 device size ? stable l ow l eakage p assivation with r ugged g lass b ody ? rohs c ompliant 1 the mps2r10 - 606 devices are supplied with gold -plated terminations. for more information, contact your microsemi representative. downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 7 3 electrical specifications 3.1 absolute maximum ratings the following table shows the absolute maximum ratings at 25 c, unless otherwise specified. table 1 absolute maximum ratings rating symbol value unit storage temperature t st - 65 to +150 oc operating temperature t op - 65 to +125 oc cw rf operating power p cw 100 w forward dc current i f 200 ma reverse dc voltage v r 150 v esd hbm class 1b moisture sensitivity msl 2 3.2 typical electrical performance t he following table shows the typical electrical performance for 100 v c ontrol. table 2 typical electrical performance (100 v control) parameter frequency (mhz) min imum typical maximum maximum cw rf input power 1 all 100 w insertion loss 100 0 .1 db 0 .12 db 500 0 .2 db 0 .25 db 1000 0 .5 db 0 .6 db return loss 100 25 db 28 db 500 13 db 15 db 1000 7 db 9 db isolation 100 55 db 60db 500 53 db 55 db 1000 45 db 47 db 1. for information about device bias, see dc bias conditions and logic . 3.3 typical electrical performance t he following table shows the typical electrical performance for 5 v co ntrol. table 3 typical electrical performance (5 v control) parameter frequency (mhz) minimum typical maximum maximum cw rf input power 1 all 1 w downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 8 parameter frequency (mhz) minimum typical maximum insertion loss 100 0 .05 db 0 .10 db 500 0 .25 db 0 .30 db 1000 0 .7 db 0 .85 db return loss 100 25 db 28 db 500 13 db 15 db 1000 7 db 9 db isolation 100 55 db 60 db 500 50 db 55 db 1000 43 db 46 db 2. maximum i nput p ower d efined as <1 db c ompression 3.4 s mall signal swept measurements the following illustrations show the small signal swept measurements. -0.7 -0.5 -0.3 -0.1 0.1 0.05 0.25 0.45 0.65 0.85 1.05 s21(db) frequency (ghz) insertion loss, 32v and 30ma -90 -70 -50 -30 0 0.2 0.4 0.6 0.8 1 1.2 s21(db) frequency (ghz) isolation, 32v and 30ma downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 9 ? bias voltage limited by test equipment. ? characteristics at no minal bias equivalent or better. -60 -50 -40 -30 -20 -10 0 0 0.2 0.4 0.6 0.8 1 1.2 s11(db) frequency (ghz) return loss common arm, 32v and 30ma downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 10 4 schematic the following illustration shows how the switching controls signals were appl ied. table 4 switching control signals band c1, c3, c5 c2, c4 l1, l2, l3 vhf (100-300 mhz) 150 pf 20 0 pf 400 nh uhf (300-1 000 mhz) 4 0 pf 5 0 pf 90 nh ism (902- 928 mhz) 15 pf 50 pf 40 nh 4.1 dc bias conditions and logic the following table shows the dc bias conditions and logic. table 5 dc bias conditions and logic bias 1 bias 2 rf in port 1 rf in port 2 -100 v, 50.0 ma <1.0 v, 30 ma low loss isolation <1.0 v, 30 ma -100 v, 50.0 ma isolation low loss downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 11 5 package outline the mps2r10 - 606 device has the following package outline specifications. downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 12 5.1 backside solder pad dimensions the mps2r10 - 606 device has the following backside solder pad dimensions. 5.2 installation and handling mmsm p roducts are compatible with both solder and silver epoxy paste assembly processes. this includes rohs solder. reflow temperatures for rohs solders such as sac sn/ag/ cu are higher than traditional pb/sn solders, so extra care must be taken when employing rohs compatible solders. silver epoxy paste is recommended for applications where power dissip ation is minimal, such as tuning varactor / schottky and low power pin diode applications. for applications with incident power levels > 30 dbm, solder attachment is strongly recommended. additionally , as with all microelectronic component assembly, care shou ld be taken to insure all circuit boards are clean and free from contamination prior to any such operation. this guide outlines the considerations for manual and automated assembly techniques utilizing either solder or silver epoxy paste. 5.2.1 manual handling a nd installation solder assembly mmsm products are designed to be compatible with modern automatic pi ck and place equipment and are available in tape and reel format as well as in gel and waffle pac ks. because of the nominal size of the units some care must be taken to avoid causing damage during installation. although storage temperature ratings (non - operating) are compatible and equivalent to ratings for standard plastic encapsulated lead -f rame commercial packages (i.e. 55 c to +125 c), temperatures dur ing solder installation can exceed this maximum value. it is critical , therefore, as with any other microelectronic part, to minimize thermal gradients across the dev ice. for example, during manual installation, typical electronic pencil soldering tips can exceed 375 c. when devices are first downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 13 soldered down to the circuit board on one end only, followed in turn by solder ing of the opposite end, the original end provides a path to thermal ground. unlike a ther mal shock test, in which both package ends are si multaneously exposed to the same temperatures, a severe thermal grad ient may be created during solder iron manual installation. specifically, if the original soldered end rests at room temperature, soldering of the second end (@tip temperature = 375 c) ma y create a temperature gradient across the device of 350 c. use of a soldering iron tip, therefore, is strongly discouraged. if a tip must be used, the following recommendation s will help minimize the risk of damage: ? limit the tip temperature to the lowes t possible temperature appropriate to exceed the liquidus point for the solder being used. ? use the smallest tip mass available to reduce the tip thermal mass relat ive to the device length. ? preheat the circuit board to 100 c 120 c to further reduce the t emperature gradient. following these recommendations will help ensure that thermal diff erentials are minimized to lower levels. silver paste assembly installation of mmsm product using s ilver epoxy paste is fairly straight forward. operators familiar with silver epoxy component assembly can easily adapt his/her technique readi ly to handle mmsm installation. epotek h20e or equivalent can be used for installation. it is critical that the paste is within the manufactures guide lines for shelf life and pot life . epoxy is dispensed and placed (see solder pad outline). the dots should be ap proximately 10 mils in diameter. using tweezers or a vacuum pencil, the mmsm is placed on the epoxy dots and lightly pressed into place. excessive epoxy can cause bridging betwe en the solder pads and short out the device. not enough epoxy can result in poor electrical or mechanical conne ction. after installation of the mmsm parts, the assembly is cured using the manufactures recommended time and temperature settings. improper cur ing can result in poor mechanical bonds as well as reduced electrical performance. see micronote 716 at www.microsemi.com for additional installation guidance. downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 14 6 evaluation board assembly the following illustrations s how the evaluation board assembly for the mps2r10 - 606 device. notes: ? order microsemi part number mstf0002 ? material: .016 rogers 4003, ? oz copper, cladding both sides start ing thickness. ? full metal backside. ? finish: enig (gold immersion), both sides. ? solder mask topside only. ? units are in inches. downloaded from: http:///
50 mhz to 1 ghz rohs compliant spdt monolithic pin switch 15 7 tape and reel format the following illustrations show the tape and reel format for the mps2r1 0 - 606 device. for the most current data, see the microsemi website at www.microsemi.com . specifications are subject to change, consult the rfmw business unit at (978 ) 442 - 5600 for the latest information. for applications information, see www.microsemi.com/design - support/application - notes#rf -and- pin - diode . downloaded from: http:///

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